SEALSQ Corp (NASDAQ: LAES) updated investors on its Quantum Application-Specific Integrated Circuit (QASIC) initiative, targeting the first prototype release in 2026. The project integrates post-quantum cryptography with custom semiconductor design to embed quantum-resistant security directly into chip architectures.
The initiative is positioned to serve cybersecurity, medical and automotive industries, with priority applications including secure microcontrollers, hardware security modules, connected medical devices and autonomous vehicle systems. SEALSQ’s broader semiconductor strategy encompasses catalog ICs, custom ICs, security IP and secure system designs, including chiplet-based hardware security modules.
IC’Alps, SEALSQ’s French ASIC design subsidiary, will contribute expertise in RISC-V-based system-on-chip infrastructure, functional safety, embedded non-volatile memory and analog/mixed-signal design. The company highlighted that the combined capabilities aim to meet the security, safety, performance and certification requirements of target markets.
SEALSQ CEO Carlos Moreira stated that products and infrastructure in these sectors often remain operational for years, making it essential to integrate post-quantum security at the semiconductor design phase. IC’Alps Managing Director Jean-Luc Triouleyre emphasized the subsidiary’s role in delivering solutions that align with evolving security and performance demands.
The announcement follows SEALSQ’s broader push to establish a Quantum Corridor linking engineering and post-quantum capabilities across Switzerland, France, Spain, the United States, South Korea and the United Arab Emirates. The initiative also aligns with collaborations involving foundries such as TSMC, GlobalFoundries, STMicro, Intel Foundry, X-FAB and ams-OSRAM.
SEALSQ’s shares closed at $2.48 on Wednesday, down $0.06 or 2.36%, before after-hours trading lifted the price to $2.50, up $0.02 or 0.81%.
