Qnity Electronics introduced its Stackplane line of chemical mechanical planarization (CMP) slurries for advanced semiconductor packaging, including hybrid bonding and through-silicon via (TSV) integration. The five-series platform is designed to support AI and high-performance computing applications by enabling higher chip density and bandwidth.
The SP1000 and SP2000 series target hybrid bonding, while the SP3000 series addresses TSV applications. The SP4000 series focuses on polymer CMP, and the SP5000 series covers panel-level through-glass vias and glass CMP. The portfolio also includes CMP pads and post-CMP cleaning solutions.
Kate Dei Cas, president of Semiconductor Technologies at Qnity, said the launch reflects demand for materials partners capable of addressing complex integration challenges as packaging technologies evolve. Allison Hsu, Taiwan Slurry R&D manager at Qnity, is scheduled to present on September 2 at SEMICON Taiwan’s TechXPOT Stage.
The Stackplane family will be showcased at SEMICON Taiwan in Taipei from September 2 to 4, with additional technical details to be presented at the International Conference on Planarization/CMP Technology in Seoul from October 19 to 22.
