South Korean memory chipmaker SK Hynix is advancing plans to construct its first large-scale semiconductor manufacturing facility in Japan, according to a report by South Korea’s Hankyoreh.
The proposed fab would be located in Miyagi Prefecture, in northeastern Japan, a region designated by Tokyo as part of its broader effort to revitalize domestic semiconductor production alongside Kyushu and Hokkaido. The project, still in preliminary stages, is being discussed at an investment scale of tens of trillions of won, though no final amount, construction timeline, or formal board approval has been confirmed.
SK Group Chairman Chey Tae-won was cited by an industry source as having recently visited Miyagi Prefecture to assess the site’s suitability. The move follows similar initiatives by foreign semiconductor firms, including U.S.-based Micron and Taiwan Semiconductor Manufacturing Co. (TSMC), which have already established manufacturing operations in Japan. Samsung Electronics operates a next-generation semiconductor packaging research center in Yokohama but does not currently run a full-scale fab in the country.
SK Hynix’s shares rose 1.5% to KRW 1.717 million on Friday, outperforming the broader KOSPI index, which declined 0.67% to close at 6,806.38. The proposed investment aligns with the chipmaker’s strategy to diversify overseas production capacity while maintaining domestic expansion in its Yongin-Honam semiconductor cluster.
The initiative is seen as a response to persistent global memory-chip supply constraints, though it may face competing priorities. The U.S. has increasingly pressured South Korean companies to expand memory-chip production within American borders, potentially diverting future capacity allocations. Additionally, the plan could encounter political and public resistance in South Korea, where concerns persist over large-scale investments in Japan within a strategically sensitive industry.
No further details on funding sources, government incentives, or operational timelines have been disclosed.
