South Korean memory chipmaker SK Hynix is evaluating Intel Foundry as a potential supplier for base dies in its next-generation HBM4E memory, according to a report by South Korean publication Herald Economy.
The move would reduce SK Hynix’s dependence on Taiwan Semiconductor Manufacturing Co (TSMC), which currently produces the base dies for SK Hynix’s HBM4 products using a 12-nanometer-class process. The consideration remains preliminary, with no finalized agreement in place regarding the scope or timing of Intel’s involvement.
SK Hynix’s HBM4E represents the seventh generation of its high-bandwidth memory portfolio. In June, the company announced it had begun shipping samples of its 12-layer HBM4E to key customers. The product is designed to deliver up to 16 gigabits per second per pin, with more than 20% higher power efficiency compared to prior generations.
Industry estimates indicate that the cost of a TSMC-produced HBM4 base die is three to four times higher than the core DRAM die, underscoring the financial significance of supply chain diversification. SK Hynix has previously shifted from in-house production of base dies to outsourcing, first to TSMC for HBM3E and later for HBM4.
The potential collaboration with Intel Foundry could introduce alternative advanced packaging technologies, including Intel’s Embedded Multi-Die Interconnect Bridge (EMIB) and TSMC’s CoWoS-S and CoWoS-L solutions, as SK Hynix evaluates its options for HBM4E production.
The report coincides with declines in semiconductor-related equities. SK Hynix shares fell 1.9% to 1.621 million won in early trading, while TSMC shares declined 1.7% to NT$2,380. The broader KOSPI index dropped 2.5%, contrasting with a 0.8% gain in the Taiex. Intel’s stock closed at $89.47, down 2.85% on August 28.
