South Korea’s SK Hynix is assessing Intel Foundry as a potential second source for base dies in its upcoming HBM4E memory stacks, according to a report citing local media outlet Herald Economy.
The move would reduce reliance on Taiwan Semiconductor Manufacturing Co (TSMC), which currently supplies the logic layers used in SK Hynix’s HBM4 products via its 12-nanometer-class process. The South Korean firm has yet to finalize terms with Intel, leaving the scope and timing of any collaboration undetermined.
HBM4E represents the seventh generation of SK Hynix’s high-bandwidth memory, with 12-layer samples delivered to major clients in June. The product targets data transfer speeds of up to 16 gigabits per second per pin and energy efficiency gains exceeding 20% over prior generations. Base dies, the logic layers at the foundation of HBM stacks, interface between memory and processors such as GPUs and CPUs.
SK Hynix previously produced base dies in-house for HBM3E but transitioned to outsourcing for HBM4. Industry estimates cited in the report indicate that TSMC’s HBM4 base die costs are three to four times higher than the DRAM die itself, creating margin pressure as the company scales HBM4E production. Long-term supply contracts in the HBM sector further limit SK Hynix’s ability to pass these costs to customers.
The potential partnership with Intel could provide additional pricing leverage and supply security. SK Hynix has evaluated advanced packaging technologies from both TSMC and Intel, including TSMC’s CoWoS-S and CoWoS-L solutions and Intel’s EMIB technology.
SK Hynix shares fell 1.9% to 1.621 million won in early trading, while the broader KOSPI index declined 2.5%. TSMC shares dropped 1.7% to NT$2,380, and Intel closed down 2.85% at $89.47 in U.S. trading.
