Qnity Electronics Inc. unveiled its Stackplane family of chemical mechanical planarization (CMP) slurries, designed for advanced semiconductor packaging applications such as hybrid bonding and through-silicon via integration.
The Stackplane line includes five series targeting different processes: the SP1000 and SP2000 for hybrid bonding, the SP3000 for through-silicon via applications, the SP4000 for polymer CMP, and the SP5000 for panel-level through-glass vias and glass CMP. The portfolio also includes complementary CMP pads and post-CMP cleaning solutions.
Kate Dei Cas, president of Semiconductor Technologies at Qnity, highlighted the growing complexity of integration challenges in packaging technologies. "As packaging technologies continue to evolve, customers need material partners capable of addressing increasingly complex integration challenges," she stated.
The company will showcase the new products at SEMICON Taiwan, held in Taipei from September 2 to September 4, at TaiNEX 2, Materials Pavilion, Booth S7930. Allison Hsu, Taiwan Slurry R&D Manager at Qnity, is scheduled to present at the TechXPOT Stage on September 2.
Qnity will also introduce the Stackplane family at the International Conference on Planarization/CMP Technology in Seoul from October 19 to October 22.
