Coherent has begun sampling 300mm silicon carbide (SiC) substrates designed for AI and high-power semiconductor applications.
The substrates, produced using Coherent’s proprietary crystal growth and wafer processing technologies, aim to meet the thermal and electrical efficiency demands of next-generation AI chips. Silicon carbide is increasingly favored in power electronics and data center infrastructure due to its superior heat dissipation and lower energy losses compared with traditional silicon.
The 300mm format aligns with industry efforts to scale wafer sizes for higher throughput and cost efficiency in semiconductor manufacturing. Coherent’s samples are expected to support AI chipmakers developing processors that require advanced thermal management to handle increasing power densities.
The company did not disclose specific customer commitments or volume targets for the initial sampling phase. Further details on commercialization timelines are pending.
