Chinese smartphone maker Xiaomi introduced its third-generation in-house processor, the Xring O3, on Monday, marking a step toward reducing dependence on external chip suppliers such as Qualcomm and MediaTek.
The new chip, manufactured by Taiwan Semiconductor Manufacturing Co (TSMC) using 3-nanometre process technology, is designed to power Xiaomi’s upcoming flagship foldable smartphone. The company plans to ship between 200,000 and 300,000 units of the Xring O3, according to internal projections reviewed by Reuters.
The Xring O3 succeeds last year’s Xring O1, which represented Xiaomi’s first major foray into proprietary smartphone processors. The latest iteration reflects the company’s broader strategy to develop and control key components, aligning with efforts by peers such as Apple, Samsung Electronics, and Huawei to differentiate premium devices through custom silicon.
Xiaomi’s push into chip design follows a period of intensified competition in the global smartphone market, where proprietary processors have become a key differentiator for flagship models. The Xring O3’s 3nm manufacturing process places it among the most advanced mobile chips currently in development, positioning Xiaomi to compete more directly in the high-end segment.
The company, listed on the Hong Kong Stock Exchange under ticker HK:1810, has not disclosed a specific launch timeline for devices powered by the Xring O3.
