BEIJING — Xiaomi introduced its third-generation in-house smartphone processor, the Xring O3, developed in collaboration with Taiwan Semiconductor Manufacturing Co (TSMC) using the chipmaker’s 3-nanometre process technology.
The new chip, which succeeds last year’s Xring O1, is designed to power the company’s forthcoming flagship foldable smartphone, according to a report citing unnamed sources. Xiaomi plans initial shipments of between 200,000 and 300,000 units of the processor.
The launch reflects Xiaomi’s strategy to reduce dependence on external semiconductor suppliers such as Qualcomm and MediaTek while enhancing product differentiation in the premium device segment. The move aligns with broader industry efforts by major smartphone manufacturers—including Apple, Samsung Electronics and Huawei—to develop proprietary chipsets to bolster performance, efficiency and brand exclusivity.
Xiaomi, listed on the Hong Kong Stock Exchange under ticker 1810, has accelerated its push into semiconductor design over the past two years, positioning the Xring series as a core component of its product roadmap. The company’s latest initiative follows TSMC’s expansion of 3nm production capacity, which has enabled tighter collaboration with global device makers seeking advanced manufacturing partnerships.
