QTREX Quantum Ltd. (NASDAQ: QTEX) has developed a patent-pending technology that converts 3D-printed dielectric material into electrically conductive carbon using laser processing, aiming to enhance quantum chip reliability.
The innovation leverages QTREX’s Additively Manufactured Electronics platform and its DF INSU300 dielectric material, with research conducted in collaboration with Northeastern University. Testing across 20 laser-processing conditions confirmed successful conductive carbon conversion, validated by Raman spectroscopy to exhibit a graphene-like structure. Electrical resistance and conversion depth are adjustable via laser power and scan speed parameters.
The technology is designed for integration into quantum computing packages as stray-photon absorbers, intercepting photons before they reach superconducting circuits. QTREX notes that stray radiation disrupts Cooper pairs, generates quasiparticles, reduces qubit lifetimes, and increases error rates in quantum systems. The solution has been validated under cryogenic temperatures and high-frequency conditions, addressing a critical challenge in scaling quantum computing architectures.
QTREX plans to commercially launch the DF INSU300 material by the end of the third quarter of 2026. Dagi Ben-Noon, Chief Executive Officer of QTREX, stated, "You cannot assemble your way to a million qubits... QTREX is turning the printed package itself into part of the protection system."
