Qnity Electronics Inc. introduced a new materials solutions platform designed for advanced semiconductor packaging, the company said Monday. The platform integrates metallization, bumping, dielectric and fine-line patterning technologies to support architectures including 2.5D, 3D and panel-level packaging used in AI-driven systems.
The platform will be presented in detail by Jason Chuang, Director of Packaging Polymers Segment at Qnity, at the Heterogeneous Integration Global Summit during SEMICON Taiwan 2026 on September 1. Qnity will also exhibit the portfolio at TaiNEX 2, Materials Pavilion, Booth S7930.
Chuck Xu, President of Qnity’s Interconnection Solutions division, said customers are seeking system-level solutions, a focus Qnity aims to address with the new platform. The portfolio includes copper solutions such as Intervia CB1000+ and CB3000, which target within-die uniformity and low-impurity copper deposition.
Additional products include the Solderon TS8000 series for tin-silver micro-bump plating, tailored for high-bandwidth memory applications. The Riston WBR5000 dry-film photoresist supports copper pillar plating with film thickness ranging from 200 to 320 µm for 2.5D packaging. Cyclotene, a photoimageable dry-film dielectric, is designed for fan-out panel-level packaging and advanced substrate applications.
The platform supports processes including direct and hybrid copper-to-copper bonding, as well as high-resolution dielectric and patterning processes capable of metallization with 2 µm lines and spaces. Supported architectures include Chip-on-Wafer-on-Substrate, Embedded Multi-die Interconnect Bridge and high-bandwidth memory configurations.
