Qnity Electronics Inc. (NYSE: Q) unveiled a materials solution platform designed for advanced semiconductor packaging, targeting architectures such as 2.5D, 3D, and panel-level systems used in AI-driven applications. The platform integrates metallization, bumping, dielectric, and fine-line patterning technologies, with capabilities including 2 µm line/space metallization and support for configurations like Chip-on-Wafer-on-Substrate and high-bandwidth memory.
The platform combines proprietary products including Intervia CB1000+ and CB3000 copper solutions, the Solderon TS8000 series tin-silver micro-bump plating for high-bandwidth memory, and Riston WBR5000 dry film photoresist for copper pillar plating with a 200–320 µm film thickness. Cyclotene, a dry film photo-imageable dielectric, is included for fan-out panel-level packaging and advanced substrate applications.
Chuck Xu, President of Interconnect Solutions at Qnity, emphasized the company’s focus on system-level solutions, stating, 'Customers are looking for system-level solutions, and that's where Qnity shines.' Jason Chuang, Packaging Polymer Segment Director, is scheduled to present further details on September 1 during the Heterogeneous Integration Global Summit at SEMICON Taiwan 2026.
Qnity will exhibit the platform at TaiNEX 2 in the Materials Pavilion, booth S7930, highlighting its role in supporting next-generation semiconductor packaging demands.
